Manz Asia and SUSS Partner to Advance Semiconductor Inkjet Printing
As semiconductor manufacturing shifts toward complex, large-format processing, Manz Asia and SUSS have formed a strategic alliance to integrate inkjet printing into high-volume production. The collaboration combines Manz Asia’s precision deposition systems with SUSS’ deep process expertise to target the rapidly evolving panel-level packaging market.
The partnership aims to replace conventional coating methods with selective material deposition, a move designed to reduce waste and simplify intricate manufacturing workflows. By leveraging Manz Asia’s Lab-to-Fab platform alongside SUSS’ global footprint, the two companies intend to accelerate the transition of inkjet technology from experimental development into scalable, industrial-grade semiconductor applications.
For SUSS, the agreement aligns with its Ambition 2030 strategy, providing a direct entry point into the panel-level packaging ecosystem. Meanwhile, Manz Asia expects the union to bridge the gap between R&D and high-volume output, specifically addressing the industry's growing demand for greater material efficiency and structural flexibility in next-generation microchip production.
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