TECHTechnology
TSMC reportedly weighs a return to memory chips
TSMC is considering re-entering the memory market, with a possible focus on next-generation 3D DRAM, according to a report by The Information. The move could put the world’s largest chipmaker in competition with Micron, Samsung and SK Hynix as demand outpaces supply and prices remain high.
The Information says TSMC may develop and produce 3D DRAM, a technology that stacks memory chips vertically to increase bandwidth and capacity while improving power efficiency. The report does not provide further details about the company’s plans.
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